At the time of the spring equinox, everything is in full bloom. Shengrun Technology has launched the new CC2340R5 series modules. At the same time, the HY-234004 series modules have completed the Bluetooth SIG BQB-5.3 identification and declaration process, CE/RED (Europe) and FCC (USA) and other regional requirements test experiments, and have been issued corresponding certification certificates. Certified modules include: HY-234004P, HY-234004PC, HY-234004I, HY-234004IC, HY-234004C, HY-234004CC, HY-234004W, HY-234004WC, a total of 8 models.
Shengrun provides a qualified design list QDL and a qualified design identifier QDID for the CC2340R5 module running TI's low-power Bluetooth stack. In this way, when customers use TI's low-power Bluetooth stack, they do not need to test the low-power Bluetooth software stack on the final product. In addition to the software stack, to achieve low-power Bluetooth compliance, the hardware must also perform physical performance testing to determine whether the RF interface meets the minimum requirements of low-power Bluetooth.
Shengrun Technology's HY-234004 series Bluetooth modules comply with global radio regulatory requirements and are equipped with a dedicated RF team to support developers and customers in obtaining relevant regional certification certificates. Instantly respond to laboratory certification materials and fixed-frequency prototype requirements during the product certification stage, and have the ability to deeply connect with laboratory certification test projects. At the same time, the Bluetooth module already has relevant regional certification certificates, which can greatly shorten the customer project cycle, reduce some certification links and save costs, speed up the speed of product launch, and help customers ride the wind and waves in the product market.
Shengrun Technology's HY-234004 series modules are based on the TI CC2340R5 4*4*0.9mm QFN24 chipset design. The wireless microcontroller uses a 48 MHz Arm® Cortex®-M0+ processor, has 512KB programmable Flash, 12KB ROM and 36KB SRAM, supports wireless OTA upgrades, and has an operating temperature range of -40℃~125℃※1. The HY-234004PC module has a size of 11.59*17.9*2.6mm, has an adjustable transmit power of -20dbm~+8dBm, Bluetooth low energy BLE 5.3 protocol stack, and the communication distance between Bluetooth modules can reach 248 meters※2. Different antenna designs can be selected according to product needs, including PCB antenna/ceramic antenna/IPEX external antenna and metal wire antenna, to adapt to different product structures and RF communication requirements.
-
Name: HY-234004CC
Communication method: UART/SPI
Size (mm): 17.91*11.6*2.2/2.7 mm
Number of pins: 16pin
Antenna type: ceramic antenna
Shield cover: optional
-
Name: HY-234004IC
Communication method: UART/SPI
Size (mm): 17.91*11.6*2.2/2.7 mm
Number of pins: 16pin
Antenna type: IPEX antenna
Shield cover: optional
-
Name: HY-234004WC
Communication method: UART/SPI
Size (mm): 17.91*11.6*2.2/2.7mm
Number of pins: 16pin
Antenna type: None (external connection required)
Shield cover: optional
-
Name Name: HY-234004PC
Communication method: UART/SPI
Size (mm): 17.91*11.6*2.2/2.7 mm
Number of pins: 16pin
Antenna type: Onboard antenna
Shield cover: Optional
-
As a powerful engine in the world of IoT, it has the following significant advantages:
High performance: The CC2340R5 chip uses the ARM Cortex-M0+ core, with a main frequency of up to 48 MHz, and has strong processing power and computing speed. At the same time, the chip has built-in rich peripheral interfaces, such as UART, SPI, I2C, etc., which is convenient for data interaction with other devices. It supports a physical layer rate of 2Mbps, has excellent receiving sensitivity and strong anti-interference ability, and +8dBm transmission power and excellent protocol error correction ability enable the module to have long-distance communication capabilities.
Low power design: HY-234004 provides Bluetooth low energy features, radio power consumption performance RX: 5.3mA, TX: 5.1mA (under 0dBm conditions), Bluetooth low energy 5.3 protocol stack, profiles and required space for customer applications. The module also provides flexible hardware interfaces for connecting sensors. In the lowest shutdown mode, it consumes only 0.15uA and wakes up in a few microseconds. Thereby extending battery life and reducing maintenance costs.
Good compatibility: TI CC2340R5 supports a variety of wireless communication protocols, such as BLE 5.3 (backward compatible), Zigbee, Thread, SimpleLink TI 15.4-stack, proprietary systems, etc., providing more possibilities for interconnection between devices. This allows devices based on this chip to easily communicate with other devices, whether existing devices or future new technology products.
Transparent firmware: Supports data transparent transmission function, slave role/host role/master-slave integration/Beacon broadcast, supports multi-device connection, and universal host design. Bidirectional data transmission is stable at 12.4KB/s, and unidirectional data transmission can reach 30KB/s.
High-precision positioning: The hardware supports Bluetooth channel detection Channel Sounding, and the software is upgradeable.
Easy to integrate: TI CC2340R5 provides a variety of interface types, such as UART, SPI, I2C, GPIO, etc., which are convenient for connection and communication with other devices. Its small package size is also easy to integrate into various products.
Wide range of application scenarios: TI CC2340R5 is suitable for various applications in the field of Internet of Things and Internet of Vehicles.
Automotive electronics: Integrating CC2340 modules in vehicles can realize vehicle remote diagnosis, location tracking and Internet of Vehicles communication, such as automotive digital key system (PEPS), automotive tire pressure monitoring (TPMS), T-Box, BMS and DC/AC charging piles.
Industrial Automation: In logistics and warehouse management, CC2340R5 chips can be used to track the location and status of goods and optimize asset management.
Healthcare: Wearable health monitors and remote patient monitoring systems to achieve real-time data transmission and remote diagnosis, such as blood glucose meters, blood pressure monitors, sensor patches, etc.
Smart Home: Used for home automation devices, such as smart bulbs, smart sockets, temperature and humidity sensors, etc., to achieve remote control and energy management.
Agricultural Monitoring: In the agricultural field, CC2340R5 chips can be used to monitor environmental parameters such as soil moisture, temperature and light intensity to achieve precision agriculture.
Smart City: Used for monitoring and management of urban infrastructure, such as traffic light control, air quality monitoring, etc.
Smart Meters: Application in water meters, electricity meters and gas meters can achieve remote meter reading and monitoring, and improve energy management efficiency.
